Ps-mpu-6052c-00 V1.0_ 3oc4z

InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A +1(408) 988–7339 www.invensense.com

Document Number: PS-MPU-6052C-00 Revision: 1.0 Release Date: 11/11/2014

MPU-6052C Product Specification Revision 1.0

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MPU-6052C Product Specification


TABLE OF CONTENTS TABLE OF TABLES ..........................................................................................................................................5 1

2

3

4

DOCUMENT INFORMATION ......................................................................................................................6 1.1

REVISION HISTORY ..............................................................................................................................6

1.2

PURPOSE AND SCOPE ..........................................................................................................................7

1.3

PRODUCT OVERVIEW ...........................................................................................................................7

1.4

APPLICATIONS .....................................................................................................................................7

FEATURES ..................................................................................................................................................8 2.1

GYROSCOPE FEATURES .......................................................................................................................8

2.2

ACCELEROMETER FEATURES ...............................................................................................................8

2.3

ADDITIONAL FEATURES ........................................................................................................................8

2.4

MOTIONPROCESSING...........................................................................................................................8

ELECTRICAL CHARACTERISTICS ...........................................................................................................9 3.1

GYROSCOPE SPECIFICATIONS ..............................................................................................................9

3.2

ACCELEROMETER SPECIFICATIONS.....................................................................................................10

3.3

ELECTRICAL SPECIFICATIONS .............................................................................................................11

3.4

I2C TIMING CHARACTERIZATION .........................................................................................................15

3.5

SPI TIMING CHARACTERIZATION.........................................................................................................16

3.6

ABSOLUTE MAXIMUM RATINGS ...........................................................................................................18

APPLICATIONS INFORMATION ..............................................................................................................19 4.1

PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .....................................................................................19

4.2

TYPICAL OPERATING CIRCUIT.............................................................................................................20

4.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ..............................................................................20

4.4

BLOCK DIAGRAM ...............................................................................................................................21

4.5

OVERVIEW ........................................................................................................................................21

4.6

THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING................................22

4.7

THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................22

4.8

DIGITAL MOTION PROCESSOR ............................................................................................................22

4.9

PRIMARY I2C AND SPI SERIAL COMMUNICATIONS INTERFACES............................................................22

4.10

AUXILIARY I2C SERIAL INTERFACE......................................................................................................24

4.11

CLOCKING .........................................................................................................................................25

4.12

SENSOR DATA S .................................................................................................................26

4.13

FIFO ................................................................................................................................................26

4.14

INTERRUPTS ......................................................................................................................................26

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4.15

DIGITAL-OUTPUT TEMPERATURE SENSOR ..........................................................................................26

4.16

BIAS AND LDOS ................................................................................................................................26

4.17

CHARGE PUMP ..................................................................................................................................26

4.18

STANDARD POWER MODES ................................................................................................................26

5

PROGRAMMABLE INTERRUPTS............................................................................................................28

6

DIGITAL INTERFACE ...............................................................................................................................29

7

6.1

I2C AND SPI SERIAL INTERFACES ......................................................................................................29

6.2

I2C INTERFACE..................................................................................................................................29

6.3

I2C COMMUNICATIONS PROTOCOL .....................................................................................................29

6.4

I C ........................................................................................................................................32

6.5

SPI INTERFACE .................................................................................................................................33

SERIAL INTERFACE CONSIDERATIONS ...............................................................................................34 7.1

8

9

2

MPU-6052C ED INTERFACES ..............................................................................................34

ASSEMBLY ...............................................................................................................................................35 8.1

ORIENTATION OF AXES ......................................................................................................................35

8.2

PACKAGE DIMENSIONS ......................................................................................................................36

PART NUMBER PACKAGE MARKING ...................................................................................................37

10 RELIABILITY .............................................................................................................................................38 10.1

QUALIFICATION TEST POLICY .............................................................................................................38

10.2

QUALIFICATION TEST PLAN ................................................................................................................38

11 REFERENCE .............................................................................................................................................39

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Table of Figures Figure 1: I2C Bus Timing Diagram ...................................................................................................................15 Figure 2: SPI Bus Timing Diagram ...................................................................................................................16 Figure 3: Pin out Diagram for MPU-6052C 4x4x0.9mm QFN ..........................................................................19 Figure 4: MPU-6052C QFN Application Schematic (I2C operation) ................................................................20 Figure 5: MPU-6052C Block Diagram ..............................................................................................................21 2 Figure 6: MPU-6052C Solution Using I C Interface .........................................................................................23 Figure 7: MPU-6052C Solution Using SPI Interface ........................................................................................24 Figure 8: START and STOP Conditions ...........................................................................................................30 2 Figure 9: Acknowledge on the I C Bus .............................................................................................................30 2 Figure 10: Complete I C Data Transfer ............................................................................................................31 Figure 11: Typical SPI Master/Slave Configuration ..........................................................................................33 Figure 12: I/O Levels and Connections ............................................................................................................34 Figure 13: Orientation of Axes of Sensitivity and Polarity of Rotation ..............................................................35

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Table of Tables Table 1: Gyroscope Specifications .....................................................................................................................9 Table 2: Accelerometer Specifications .............................................................................................................10 Table 3: D.C. Electrical Characteristics ............................................................................................................11 Table 4: A.C. Electrical Characteristics ............................................................................................................13 Table 5: Other Electrical Specifications ............................................................................................................14 2 Table 6: I C Timing Characteristics ..................................................................................................................15 Table 7: SPI Timing Characteristics .................................................................................................................16 Table 8: fCLK = 20MHz ....................................................................................................................................17 Table 9: Absolute Maximum Ratings ................................................................................................................18 Table 10: Signal Descriptions ...........................................................................................................................19 Table 11: Bill of Materials .................................................................................................................................20 Table 12: Standard Power Modes for MPU-6052C ..........................................................................................27 Table 13: Table of Interrupt Sources ................................................................................................................28 Table 14: Serial Interface..................................................................................................................................29 2 Table 15: I C ..........................................................................................................................................32

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1 1.1

Document Information Revision History

Revision Date

Revision

Description

11/11/2014

1.0

Initial Release

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1.2 Purpose and Scope This document is a product specification, providing a description, specifications, and design related information on the MPU-6052C™ MotionTracking device. The device is housed in a small 4x4x0.90mm QFN package. Specifications are subject to change without notice. For references to map and descriptions of individual s, please refer to the MPU-6052C Map and Descriptions document.

1.3 Product Overview The MPU-6052C is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital Motion Processor™ (DMP) all in a small 4x4x0.9mm package. It also features a 512 byte FIFO that can lower the traffic on the serial bus interface, and reduce power consumption by allowing the system 2 processor to burst read sensor data and then go into a low-power mode. With its dedicated I C sensor bus, 2 the MPU-6052C directly accepts inputs from external I C devices. MPU-6052C, with its 6-axis integration, on-chip DMP, and run-time calibration firmware, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. MPU-6052C is also designed to interface with multiple non-inertial digital 2 sensors, such as pressure sensors, on its auxiliary I C port. The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and very low rate noise at 0.01 dps/√Hz. The accelerometer has a -programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-line calibration requirements. Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The 2 device features I C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital IO supply, VDDIO from 1.71V to 3.6V. 2

Communication with all s of the device is performed using either I C at 400kHz or SPI at 1MHz. For applications requiring faster communications, the sensor and interrupt s may be read using SPI at 20MHz. By leveraging its patented and volume-proven CMOS-MEMS Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 4x4x0.9mm (24-pin QFN), to provide a very small yet high performance low cost package. The device provides high robustness by ing 10,000g shock reliability.

1.4

Applications  TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)  MotionCommand™ technology (for Gesture Short-cuts)  Motion-enabled game and application framework  Location based services, points of interest, and dead reckoning  Handset and portable gaming  Motion-based game controllers  3D remote controls for Internet connected DTVs and set top boxes, 3D mice  Wearable sensors for health, fitness and sports

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2


Features

2.1 Gyroscope Features The triple-axis MEMS gyroscope in the MPU-6052C includes a wide range of features:   

Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a -programmable fullscale range of ±250, ±500, ±1000, and ±2000°/sec and integrated 16-bit ADCs Digitally-programmable low- filter Factory calibrated sensitivity scale factor

2.2 Accelerometer Features The triple-axis MEMS accelerometer in MPU-6052C includes a wide range of features:  

Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g and integrated 16-bit ADCs -programmable interrupts

2.3 Additional Features The MPU-6052C includes the following additional features:              2.4

2

Auxiliary master I C bus for reading data from external sensors (e.g. magnetometer) VDD supply voltage range of 1.8 – 3.3V ± 5% 2 VDDIO reference voltage of 1.8 – 3.3V ± 5% for auxiliary I C devices Minimal cross-axis sensitivity between the accelerometer and gyroscope axes 512 byte FIFO buffer enables the applications processor to read the data in bursts Digital-output temperature sensor -programmable digital filters for gyroscope, accelerometer, and temp sensor 10,000 g shock tolerant 2 400kHz Fast Mode I C for communicating with all s 1MHz SPI serial interface for communicating with all s 20MHz SPI serial interface for reading sensor and interrupt s MEMS structure hermetically sealed and bonded at wafer level RoHS and Green compliant

MotionProcessing Internal Digital Motion Processing™ (DMP™) engine s advanced MotionProcessing and low power functions such as gesture recognition using programmable interrupts  In addition to the angular rate, this device optionally outputs the angular position (angle).  Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the step count. 

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3

Electrical Characteristics

3.1 Gyroscope Specifications Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. PARAMETER GYROSCOPE SENSITIVITY Full-Scale Range

CONDITIONS FS_SEL=0 FS_SEL=1 FS_SEL=2 FS_SEL=3

Gyroscope ADC Word Length Sensitivity Scale Factor

Sensitivity Scale Factor Tolerance Sensitivity Scale Factor Variation Over Temperature Nonlinearity Cross-Axis Sensitivity GYROSCOPE ZERO-RATE OUTPUT (ZRO) Initial ZRO Tolerance ZRO Variation Over Temperature Power-Supply Sensitivity (1-10Hz) Power-Supply Sensitivity (10 - 250Hz) Power-Supply Sensitivity (250Hz - 100kHz) Linear Acceleration Sensitivity GYROSCOPE NOISE PERFORMANCE Total RMS Noise GYROSCOPE MECHANICAL FREQUENCIES LOW FILTER RESPONSE

MIN

FS_SEL=0 FS_SEL=1 FS_SEL=2 FS_SEL=3 25°C 0°C to +55°C

-6

TYP ±250 ±500 ±1000 ±2000 16 131 65.5 32.8 16.4 ±2 ±10

MAX

+6

UNITS º/s º/s º/s º/s bits LSB/(º/s) LSB/(º/s) LSB/(º/s) LSB/(º/s) % %

Best fit straight line; 25°C

0.2 ±2

% %

25°C 0°C to +55°C Sine wave, 100mVpp; VDD=2.5V Sine wave, 100mVpp; VDD=2.5V Sine wave, 100mVpp; VDD=2.5V Static FS_SEL=0 DLPFCFG=2 (100Hz)

±60 ±40 0.2 0.2 4 0.1

º/s º/s º/s º/s º/s º/s/g

25

0.7 27

29

º/s-rms kHz

Programmable Range

5

250

Hz

Programmable DLPFCFG=0 to ±1º/s of Final

4

8,000

Hz

OUTPUT DATA RATE GYROSCOPE START-UP TIME ZRO Settling

50

Table 1: Gyroscope Specifications

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ms

NOTES



3.2 Accelerometer Specifications Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. PARAMETER ACCELEROMETER SENSITIVITY Full-Scale Range

ADC Word Length Sensitivity Scale Factor

Initial Calibration Tolerance Sensitivity Change vs. Temperature Nonlinearity Cross-Axis Sensitivity ZERO-G OUTPUT Initial Calibration Tolerance1 Zero-G Level Change vs. Temperature NOISE PERFORMANCE Power Spectral Density LOW FILTER RESPONSE

CONDITIONS

MIN

AFS_SEL=0 AFS_SEL=1 AFS_SEL=2 AFS_SEL=3 Output in two’s complement format AFS_SEL=0 AFS_SEL=1 AFS_SEL=2 AFS_SEL=3

TYP

MAX

±2 ±4 ±8 ±16 16 16,384 8,192 4,096 2,048 ±3 ±0.02 0.5 ±2

AFS_SEL=0, -40°C to +85°C Best Fit Straight Line

UNITS g g g g bits LSB/g LSB/g LSB/g LSB/g % %/°C % %

X and Y axes Z axis X and Y axes, 0°C to +70°C Z axis, 0°C to +70°C

±80 ±200 ±60 ±150

mg mg

@10Hz, AFS_SEL=0 & ODR=1kHz

400

g/√Hz

mg

Programmable Range

5.05

218.1

Hz

Programmable Range

4

1,000

Hz

OUTPUT DATA RATE

Table 2: Accelerometer Specifications

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NOTES


3.3


Electrical Specifications

3.3.1

D.C. Electrical Characteristics

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. PARAMETER

CONDITIONS

MIN

TYP

MAX

Units

Notes

VDD

1.71

1.8

3.45

V

1

VDDIO

1.71

1.8

3.45

V

1

SUPPLY VOLTAGES

SUPPLY CURRENTS Normal Mode

Accelerometer Low Power Mode

6-axis

3.4

mA

1

3-axis Gyroscope

3.2

mA

1

3-Axis Accelerometer, 4kHz ODR

450

µA

1

0.98 Hz update rate

7.27

µA

1,2

31.25 Hz update rate

18.65

µA

1,2

1.6 6

mA µA

1 1

°C

1

Standby Mode Full-Chip Sleep Mode TEMPERATURE RANGE Specified Temperature Range

Performance parameters are not applicable beyond Specified Temperature Range

-40

+85

Table 3: D.C. Electrical Characteristics Notes: 1. Derived from validation or characterization of parts, not guaranteed in production. 2. Accelerometer Low Power Mode s the following output data rates (ODRs): 0.24, 0.49, 0.98, 1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rate can be calculated as: a. Supply Current in µA = 6.9 + Update Rate * 0.376

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3.3.2

A.C. Electrical Characteristics

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. Parameter

Conditions

MIN

TYP

MAX

Units

100

ms

85

°C

NOTES

SUPPLIES Supply Ramp Time

Monotonic ramp. Ramp rate is 10% to 90% of the final value

Operating Range

Ambient

Sensitivity

Untrimmed

Room Temp Offset

21°C

0.1

1

TEMPERATURE SENSOR -40 333.87

LSB/°C

0

LSB

1

Power-On RESET Supply Ramp Time (TRAMP)

Valid power-on RESET

Start-up time for read/write

From power-up

I2C ADDRESS

AD0 = 0 AD0 = 1

0.01

20

100

ms

1

11

100

ms

1

0.3*VDDIO

V V pF

1

1101000 1101001

DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS) VIH, High Level Input Voltage VIL, Low Level Input Voltage CI, Input Capacitance

0.7*VDDIO < 10 DIGITAL OUTPUT (SDO, INT)

VOH, High Level Output Voltage VOL1, LOW-Level Output Voltage VOL.INT1, INT Low-Level Output Voltage Output Leakage Current tINT, INT Pulse Width

RLOAD=1MΩ; RLOAD=1MΩ;

0.9*VDDIO 0.1*VDDIO 0.1

OPEN=1, 0.3mA sink Current OPEN=1 LATCH_INT_EN=0

100 50

V V V

1

nA µs

I2C I/O (SCL, SDA) VIL, LOW Level Input Voltage VIH, HIGH-Level Input Voltage Vhys, Hysteresis VOL, LOW-Level Output Voltage IOL, LOW-Level Output Current Output Leakage Current tof, Output Fall Time from VIHmax to VILmax

-0.5V 0.7*VDDIO

0.3*VDDIO VDDIO + 0.5V 0.1*VDDIO

3mA sink current VOL=0.4V VOL=0.6V Cb bus capacitance in pf

0

0.4 3 6 100

20+0.1Cb

250

V V V V mA mA nA ns

1

AUXILLIARY I/O (AUX_CL, AUX_DA) VIL, LOW-Level Input Voltage VIH, HIGH-Level Input Voltage Vhys, Hysteresis VOL1, LOW-Level Output Voltage

-0.5V 0.7* VDDIO

0.3*VDDIO VDDIO + 0.5V 0.1* VDDIO

VDDIO > 2V; 1mA sink current

0

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0.4

V V V V

1



Parameter VOL3, LOW-Level Output Voltage IOL, LOW-Level Output Current Output Leakage Current tof, Output Fall Time from VIHmax to VILmax

Conditions VDDIO < 2V; 1mA sink current VOL = 0.4V VOL = 0.6V Cb bus capacitance in pF

MIN 0

TYP

MAX 0.2* VDDIO

Units V

250

mA mA nA ns

3 6 100 20+0.1Cb

NOTES

INTERNAL CLOCK SOURCE

Sample Rate

Clock Frequency Initial Tolerance Frequency Variation over Temperature

Fchoice=0,1,2 SMPLRT_DIV=0 Fchoice=3; DLPFCFG=0 or 7 SMPLRT_DIV=0 Fchoice=3; DLPFCFG=1,2,3,4,5,6; SMPLRT_DIV=0 CLK_SEL=0, 6; 25°C CLK_SEL=1,2,3,4,5; 25°C CLK_SEL=0,6 CLK_SEL=1,2,3,4,5

32

kHz

2

8

kHz

2

1

kHz

2

% % % %

1 1 1 1

-2 -1 -10

+2 +1 +10 ±1

Table 4: A.C. Electrical Characteristics Notes: 1. Derived from validation or characterization of parts, not guaranteed in production. 2. Guaranteed by design.

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3.3.3

Other Electrical Specifications

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. PARAMETER

CONDITIONS

MIN

TYP

MAX

Units

Notes

SERIAL INTERFACE SPI Operating Frequency, All s Read/Write

Low Speed Characterization High Speed Characterization

SPI Operating Frequency, Sensor and Interrupt s Read Only I2C Operating Frequency

100 ±10% 1 ±10%

kHz

1

MHz

1

20 ±10%

MHz

1

kHz kHz

1 1

All s, Fast-mode All s, Standard-mode

400 100

Table 5: Other Electrical Specifications Notes: 1. Derived from validation or characterization of parts, not guaranteed in production.

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3.4 I2C Timing Characterization Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. Parameters I2C TIMING fSCL, SCL Clock Frequency tHD.STA, (Repeated) START Condition Hold Time tLOW, SCL Low Period tHIGH, SCL High Period tSU.STA, Repeated START Condition Setup Time tHD.DAT, SDA Data Hold Time tSU.DAT, SDA Data Setup Time tr, SDA and SCL Rise Time tf, SDA and SCL Fall Time tSU.STO, STOP Condition Setup Time

Conditions I2C FAST-MODE

Min

Cb bus cap. from 10 to 400pF Cb bus cap. from 10 to 400pF

tBUF, Bus Free Time Between STOP and START Condition Cb, Capacitive Load for each Bus Line tVD.DAT, Data Valid Time tVD.ACK, Data Valid Acknowledge Time

Typical

Max

Units

400 0.6

kHz µs

Notes 1 2 2

1.3 0.6 0.6

µs µs µs

2 2 2

0 100 20+0.1Cb 20+0.1Cb 0.6

µs ns ns ns µs

2 2 2 2 2

µs

2

pF µs µs

2 2 2

300 300

1.3 < 400 0.9 0.9 2

Table 6: I C Timing Characteristics Notes: 1. 2.

Timing Characteristics apply to both Primary and Auxiliary I2C Bus Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

Figure 1: I2C Bus Timing Diagram

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3.5


SPI Timing Characterization

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted. Parameters

Conditions

Min

Typical

Max

Units

Notes

1

MHz

1

SPI TIMING fSCLK, SCLK Clock Frequency tLOW, SCLK Low Period

400

ns

1

tHIGH, SCLK High Period

400

ns

1

tSU.CS, CS Setup Time

8

ns

1

tHD.CS, CS Hold Time

500

ns

1

tSU.SDI, SDI Setup Time

11

ns

1

ns

1

ns

1

ns

1

ns

1

tHD.SDI, SDI Hold Time

7

tVD.SDO, SDO Valid Time

Cload = 20pF

tHD.SDO, SDO Hold Time

Cload = 20pF

100 4

tDIS.SDO, SDO Output Disable Time

50

Table 7: SPI Timing Characteristics Notes: 1.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

Figure 2: SPI Bus Timing Diagram

3.5.1

fSCLK = 20MHz

Parameters

Conditions

Min

Typical

Max

Units

Notes

0.9

20

MHz

1

tLOW, SCLK Low Period

-

-

ns

tHIGH, SCLK High Period

-

-

ns

tSU.CS, CS Setup Time

1

ns

1

tHD.CS, CS Hold Time

1

ns

1

SPI TIMING fSCLK, SCLK Clock Frequency

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tSU.SDI, SDI Setup Time

0

ns

1

tHD.SDI, SDI Hold Time

1

ns

1

ns

1

ns

1

tVD.SDO, SDO Valid Time

Cload = 20pF

25

tDIS.SDO, SDO Output Disable Time

25

Table 8: fCLK = 20MHz Notes: 1.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

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3.6


Absolute Maximum Ratings

Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.

Parameter

Rating

Supply Voltage, VDD

-0.5V to +4V

Supply Voltage, VDDIO

-0.5V to +4V

REGOUT

-0.5V to 2V

Input Voltage Level (AUX_DA, AD0, FSYNC, INT, SCL, SDA)

-0.5V to VDD + 0.5V

Acceleration (Any Axis, unpowered)

10,000g for 0.2ms

Operating Temperature Range

-40°C to +105°C

Storage Temperature Range

-40°C to +125°C 2kV (HBM);

Electrostatic Discharge (ESD) Protection

250V (MM)

Latch-up

JEDEC Class II (2),125°C, ±100mA

Table 9: Absolute Maximum Ratings

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Pin Out Diagram and Signal Description Pin Number

Pin Name

6

AUX_DA

I2C master serial data, for connecting to external sensors

Pin Description

7

AUX_CL

I2C Master serial clock, for connecting to external sensors

8

VDDIO

9

AD0 / SDO

10

REGOUT

11

FSYNC

12

INT

Interrupt digital output (totem pole or open-drain)

13

VDD

Power supply voltage

18

GND

Power supply ground

19, 20, 21

RESV

Reserved. Do not connect.

22

RESV / nCS

Reserved in I2C mode. “Blue Wire” to VDDIO; Chip select (SPI mode only)

23

SCL / SCLK

I2C serial clock (SCL); SPI serial clock (SCLK)

24

SDA / SDI

1, 2, 3, 4, 5, 14, 15, 16, 17

NC

Digital I/O supply voltage I2C Slave Address LSB (AD0); SPI serial data output (SDO) Regulator filter capacitor connection Frame synchronization digital input. Connect to GND if unused.

I2C serial data (SDA); SPI serial data input (SDI) No Connect pins. Do not connect.

SDA / SDI

SCL / SCLK

RESV / nCS

RESV

RESV

RESV

24

23

22

21

20

19

Table 10: Signal Descriptions

NC

1

18 GND

NC

2

17 NC

NC

3

NC

4

15 NC

NC

5

14 NC

AUX_DA

6

13 VDD

16 NC

10

11

12

FSYNC

INT

9 SDO / AD0

REGOUT

8 VDDIO

MPU-6052C

7

4.1

Applications Information

AUX_CL

4


Figure 3: Pin out Diagram for MPU-6052C 4x4x0.9mm QFN

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4.2

Typical Operating Circuit

RESV

RESV 19

20

21 RESV

22

SCL / SCLK 23

SDA / SDI 24

RESV/nCS

VDDIO SCL SDA

GND

NC

1

18

NC

2

17 NC 16 NC

NC

3

NC

4

15 NC

NC

5

14 NC

6

13 VDD

MPU-6052C

12

1.8 – 3.3VDC C2, 0.1 F

INT

11 FSYNC

9

REGOUT 10

8 VDDIO

C3, 10 nF

SDO / AD0

1.8 – 3.3VDC

AUX_CL

7

AUX_DA

C1, 0.1 F

AD0

Figure 4: MPU-6052C QFN Application Schematic (I2C operation)

4.3

Bill of Materials for External Components Component

Label

Specification

Quantity

Regulator Filter Capacitor

C1

Ceramic, X7R, 0.1µF ±10%, 2V

1

VDD By Capacitor

C2

Ceramic, X7R, 0.1µF ±10%, 4V

1

VDDIO By Capacitor

C3

Ceramic, X7R, 10nF ±10%, 4V

1

Table 11: Bill of Materials

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4.4

Block Diagram

MPU-6052C X Accel

ADC

Y Accel

ADC

INT

Interrupt Status

nCS Slave I2C and SPI Serial Interface

FIFO

AD0 / SDO SCL / SCLK SDA / SDI

ADC

X Gyro

ADC

Y Gyro

Z Gyro

Temp Sensor

Signal Conditioning

Z Accel

& Config s Serial Interface By Mux

Master I2C Serial Interface

Sensor s

Digital Motion Processor (DMP)

ADC

ADC

Bias & LDOs

VDD

GND

REGOUT

Figure 5: MPU-6052C Block Diagram

Overview

The MPU-6052C is comprised of the following key blocks and functions:             

AUX_DA

FSYNC

ADC

Charge Pump

4.5

AUX_CL

Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning Digital Motion Processor (DMP) engine 2 Primary I C and SPI serial communications interfaces 2 Auxiliary I C serial interface Clocking Sensor Data s FIFO Interrupts Digital-Output Temperature Sensor Bias and LDOs Charge Pump Standard Power Modes

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4.6


Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning

The MPU-6052C consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the angular rate. This voltage is digitized using individual on-chip 16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and -selectable low- filters enable a wide range of cut-off frequencies.

4.7

Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning

The MPU-6052C’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially. The MPU-6052C’s architecture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing digital outputs. The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.

4.8

Digital Motion Processor

The embedded Digital Motion Processor (DMP) within the MPU-6052C offloads computation of motion processing algorithms from the host processor. The DMP acquires data from accelerometers, gyroscopes, rd and additional 3 party sensors such as magnetometers, and processes the data. The resulting data can be read from the FIFO. The DMP has access to one of the MPU’s external pins, which can be used for generating interrupts. The purpose of the DMP is to offload both timing requirements and processing power from the host processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, in order to provide accurate results with low latency. This is required even if the application updates at a much lower rate; for example, a low power interface may update as slowly as 5Hz, but the motion processing should still run at 200Hz. The DMP can be used to minimize power, simplify timing, simplify the software architecture, and save valuable MIPS on the host processor for use in applications. The DMP s the following functionality:    4.9

Low Power Quaternion (3-Axis Gyroscope) Screen Orientation (A low-power implementation of Android’s screen rotation algorithm) Pedometer (InvenSense implementation) Primary I2C and SPI Serial Communications Interfaces 2

The MPU-6052C communicates to a system processor using either a SPI or an I C serial interface. The 2 MPU-6052C always acts as a slave when communicating to the system processor. The LSB of the of the I C slave address is set by pin 9 (AD0).

4.9.1

MPU-6052C Solution Using I2C Interface 2

In the figure below, the system processor is an I C master to the MPU-6052C. In addition, the MPU-6052C is 2 2 an I C master to the optional external com sensor. The MPU-6052C has limited capabilities as an I C Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors.

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2

The MPU-6052C has an interface by multiplexer, which connects the system processor I C bus pins 23 2 and 24 (SDA and SCL) directly to the auxiliary sensor I C bus pins 6 and 7 (AUX_DA and AUX_CL). Once the auxiliary sensors have been configured by the system processor, the interface by multiplexer 2 2 should be disabled so that the MPU-6052C auxiliary I C master can take control of the sensor I C bus and gather data from the auxiliary sensors. 2

For further information regarding I C master control, please refer to section 6.

Interrupt Status

I2C Processor Bus: for reading all sensor data from MPU and for configuring external sensors (i.e. com in this example)

INT

MPU-6052C

AD0 Slave I2C or SPI Serial Interface

VDD or GND

SCL

SCL

SDA/SDI

SDA

FIFO Sensor I2C Bus: for configuring and reading from external sensors

& Config s

Optional Sensor Master I2C Serial Interface

Sensor

Interface By Mux

AUX_CL

SCL

AUX_DA

SDA

Com

Factory Calibration Digital Motion Processor (DMP) Interface by mux allows direct configuration of com by system processor

Bias & LDOs

VDD

GND

REGOUT

2

Figure 6: MPU-6052C Solution Using I C Interface

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System Processor


4.9.2


MPU-6052C Solution Using SPI Interface

In the figure below, the system processor is an SPI master to the MPU-6052C. Pins 8, 9, 23, and 24 are used to the CS, SDO, SCLK, and SDI signals for SPI communications. Because these SPI pins are 2 2 shared with the I C slave pins (9, 23 and 24), the system processor cannot access the auxiliary I C bus 2 2 through the interface by multiplexer, which connects the processor I C interface pins to the sensor I C 2 interface pins. Since the MPU-6052C has limited capabilities as an I C Master, and depends on the system processor to manage the initial configuration of any auxiliary sensors, another method must be used for 2 programming the sensors on the auxiliary sensor I C bus pins 6 and 7 (AUX_DA and AUX_CL). When using SPI communications between the MPU-6052C and the system processor, configuration of 2 2 devices on the auxiliary I C sensor bus can be achieved by using I C Slaves 0-4 to perform read and write 2 2 transactions on any device and on the auxiliary I C bus. The I C Slave 4 interface can be used to perform only single byte read and write transactions. Once the external sensors have been configured, the 2 MPU-6052C can perform single or multi-byte reads using the sensor I C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer as well as to the external sensor s. 2

For further information regarding the control of the MPU-6052C’s auxiliary I C interface, please refer to the MPU-6052C Map and Descriptions document. Processor SPI Bus: for reading all data from MPU and for configuring MPU and external sensors Interrupt Status

INT

nCS

nCS

MPU-6052C

SDO

Slave I2C or SPI Serial Interface

SDI

SCLK

SCLK

SDI

System Processor

SDO

FIFO 2

Sensor I C Bus: for configuring and reading data from external sensors

Config

Optional Sensor Master I2C Serial Interface

Sensor

Interface By Mux

AUX_CL

SCL

AUX_DA

SDA

Com

Factory Calibration Digital Motion Processor (DMP)

I2C Master performs read and write transactions on Sensor I2C bus.

Bias & LDOs

VDD

GND

REGOUT

Figure 7: MPU-6052C Solution Using SPI Interface

4.10 Auxiliary I2C Serial Interface 2

The MPU-6052C has an auxiliary I C bus for communicating to an off-chip 3-Axis digital output magnetometer or other sensors. This bus has two operating modes:  

2

I C Master Mode: The MPU-6052C acts as a master to any external sensors connected to the 2 auxiliary I C bus 2 -Through Mode: The MPU-6052C directly connects the primary and auxiliary I C buses together, allowing the system processor to directly communicate with any external sensors.

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2

Auxiliary I C Bus Modes of Operation: 

2

I C Master Mode: Allows the MPU-6052C to directly access the data s of external digital sensors, such as a magnetometer. In this mode, the MPU-6052C directly obtains data from auxiliary sensors without intervention from the system applications processor. 2

For example, In I C Master mode, the MPU-6052C can be configured to perform burst reads, returning the following data from a magnetometer:  X magnetometer data (2 bytes)  Y magnetometer data (2 bytes)  Z magnetometer data (2 bytes) 2 The I C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor can be configured to work single byte read/write mode. 

-Through Mode: Allows an external system processor to act as master and directly 2 communicate to the external sensors connected to the auxiliary I C bus pins (AUX_DA and 2 rd AUX_CL). In this mode, the auxiliary I C bus control logic (3 party sensor interface block) of the 2 MPU-6052C is disabled, and the auxiliary I C pins AUX_DA and AUX_CL (Pins 6 and 7) are 2 connected to the main I C bus (Pins 23 and 24) through analog switches internally. -Through mode is useful for configuring the external sensors, or for keeping the MPU-6052C in a low-power mode when only the external sensors are used. In this mode the system processor can 2 still access MPU-6052C data through the I C interface.

4.11 Clocking The MPU-6052C has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the DMP, and various control circuits and s. An on-chip PLL provides flexibility in the allowable inputs for generating this clock. Allowable internal sources for generating the internal clock are:  

An internal relaxation oscillator Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

Selection of the source for generating the internal synchronous clock depends on the requirements for power consumption and clock accuracy. These requirements will most likely vary by mode of operation. For example, in one mode, where the biggest concern is power consumption, the may wish to operate the Digital Motion Processor of the MPU-6052C to process accelerometer data, while keeping the gyros off. In this case, the internal relaxation oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source provides for a more accurate clock source. Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed by the Digital Motion Processor (and by extension, by any processor). There are also start-up conditions to consider. When the MPU-6052C first starts up, the device uses its internal clock until programmed to operate from another source. This allows the , for example, to wait for the MEMS oscillators to stabilize before they are selected as the clock source.

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4.12 Sensor Data s The sensor data s contain the latest gyro, accelerometer, auxiliary sensor, and temperature measurement data. They are read-only s, and are accessed via the serial interface. Data from these s may be read anytime.

4.13 FIFO The MPU-6052C contains a 512 byte FIFO that is accessible via the Serial Interface. The FIFO configuration determines which data is written into the FIFO. Possible choices include gyro data, accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter keeps track of how many bytes of valid data are contained in the FIFO. The FIFO s burst reads. The interrupt function may be used to determine when new data is available. For further information regarding the FIFO, please refer to the MPU-6052C Map and Descriptions document.

4.14 Interrupts Interrupt functionality is configured via the Interrupt Configuration . Items that are configurable include the INT pin configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock sources); (2) new data is available to be read (from the FIFO and Data s); (3) accelerometer event interrupts; and (4) the MPU-6052C did not receive an acknowledge from an auxiliary sensor on the 2 secondary I C bus. The interrupt status can be read from the Interrupt Status . For further information regarding interrupts, please refer to the MPU-6052C Map and Descriptions document.

4.15 Digital-Output Temperature Sensor An on-chip temperature sensor and ADC are used to measure the MPU-6052C die temperature. readings from the ADC can be read from the FIFO or the Sensor Data s.

The

4.16 Bias and LDOs The bias and LDO section generates the internal supply and the reference voltages and currents required by the MPU-6052C. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO output is byed by a capacitor at REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External Components.

4.17 Charge Pump An on-chip charge pump generates the high voltage required for the MEMS oscillators.

4.18 Standard Power Modes The following table lists the -accessible power modes for MPU-6052C.

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Mode

Name

Gyro

Accel

DMP

1

Sleep Mode

Off

Off

Off

2

Standby Mode

Drive On

Off

Off

3

Low-Power Accelerometer Mode

Off

Duty-Cycled

Off

4

Low-Noise Accelerometer Mode

Off

On

Off

5

Gyroscope Mode

On

Off

On or Off

6

6-Axis Mode

On

On

On or Off

Table 12: Standard Power Modes for MPU-6052C Notes: 1. Power consumption for individual modes can be found in section 3.3.1.

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5


Programmable Interrupts

The MPU-6052C has a programmable interrupt system which can generate an interrupt signal on the INT pin. Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.

Interrupt Name

Module

Motion Detection

Motion

FIFO Overflow

FIFO

Data Ready

Sensor s

I2C Master errors: Lost Arbitration, NACKs

I2C Master

I2C Slave 4

I2C Master

Table 13: Table of Interrupt Sources

For information regarding the interrupt enable/disable s and flag s, please refer to the MPU6052C Map and Descriptions document. Some interrupt sources are explained below.

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6


Digital Interface

6.1

I2C and SPI Serial Interfaces 2

The internal s and memory of the MPU-6052C can be accessed using either I C at 400 kHz or SPI at 1MHz. SPI operates in four-wire mode.

Pin Number

Pin Name

8

VDDIO

Pin Description

9

AD0 / SDO

I2C Slave Address LSB (AD0); SPI serial data output (SDO)

23

SCL / SCLK

I2C serial clock (SCL); SPI serial clock (SCLK)

24

SDA / SDI

Digital I/O supply voltage.

I2C serial data (SDA); SPI serial data input (SDI)

Table 14: Serial Interface

Note: 2

2

To prevent switching into I C mode when using SPI, the I C interface should be disabled by setting the I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time specified by the “Start-Up Time for Read/Write” in Section 6.3. For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6052C Map and Descriptions document.

6.2

I2C Interface

2

I C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the 2 lines are open-drain and bi-directional. In a generalized I C interface implementation, attached devices can be a master or a slave. The master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master. The MPU-6052C always operates as a slave device when communicating to the system processor, which thus acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is 400 kHz. The slave address of the MPU-6052C is b110100X which is 7 bits long. The LSB bit of the 7 bit address is 2 determined by the logic level on pin AD0. This allows two MPU-6052Cs to be connected to the same I C bus. When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic low) and the address of the other should be b1101001 (pin AD0 is logic high).

6.3

I2C Communications Protocol

START (S) and STOP (P) Conditions 2

Communication on the I C bus starts when the master puts the START condition (S) on the bus, which is defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while SCL is HIGH (see figure below). Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

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SDA

SCL S

P

START condition

STOP condition

Figure 8: START and STOP Conditions

Data Format / Acknowledge 2

I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse. If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready, and releases the clock line (refer to the following figure).

DATA OUTPUT BY TRANSMITTER (SDA) not acknowledge DATA OUTPUT BY RECEIVER (SDA) acknowledge SCL FROM MASTER

1

2

8

9

clock pulse for acknowledgement

START condition 2

Figure 9: Acknowledge on the I C Bus

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Communications After beginning communications with the START condition (S), the master sends a 7-bit slave address th followed by an 8 bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device. Each byte transferred must be followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of the SCL line. Data transmission is always terminated by the master with a STOP condition (P), thus freeing the communications line. However, the master can generate a repeated START condition (Sr), and address another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the exception of start and stop conditions.

SDA

SCL

1–7

8

9

1–7

8

9

1–7

8

9

S

P

START ADDRESS condition

R/W

ACK

DATA

ACK

DATA

ACK

STOP condition

2

Figure 10: Complete I C Data Transfer 2

To write the internal MPU-6052C s, the master transmits the start condition (S), followed by the I C th address and the write bit (0). At the 9 clock cycle (when the clock is high), the MPU-6052C acknowledges the transfer. Then the master puts the address (RA) on the bus. After the MPU-6052C acknowledges the reception of the address, the master puts the data onto the bus. This is followed by the ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple bytes after the last ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the MPU-6052C automatically increments the address and loads the data to the appropriate . The following figures show single and two-byte write sequences.

Single-Byte Write Sequence Master

S

AD+W

Slave

RA ACK

DATA ACK

P ACK

Burst Write Sequence Master Slave

S

AD+W

RA ACK

DATA ACK

DATA ACK

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P ACK



2

To read the internal MPU-6052C s, the master sends a start condition, followed by the I C address and a write bit, and then the address that is going to be read. Upon receiving the ACK signal from the MPU-6052C, the master transmits a start signal followed by the slave address and read bit. As a result, the MPU-6052C sends an ACK signal and the data. The communication ends with a not acknowledge (NACK) signal and a stop bit from master. The NACK condition is defined such that the SDA line remains th high at the 9 clock cycle. The following figures show single and two-byte read sequences.

Single-Byte Read Sequence Master

S

AD+W

Slave

RA ACK

S

AD+R

NACK

ACK

ACK

P

DATA

Burst Read Sequence Master

S

AD+W

Slave

6.4

RA ACK

S

AD+R

ACK

ACK

ACK

DATA

NACK DATA

2

I C

Signal S AD W R ACK NACK RA DATA P

Description Start Condition: SDA goes from high to low while SCL is high 2 Slave I C address Write bit (0) Read bit (1) Acknowledge: SDA line is low while the SCL line is high at the th 9 clock cycle th Not-Acknowledge: SDA line stays high at the 9 clock cycle MPU-6052C internal address Transmit or received data Stop condition: SDA going from low to high while SCL is high 2

Table 15: I C

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P



6.5

SPI Interface

SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6052C always operates as a Slave device during standard Master-Slave SPI operation. With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select (CS) line from the master. CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state so that they do not interfere with any active devices. SPI Operational Features 1. 2. 3. 4. 5.

Data is delivered MSB first and LSB last Data is latched on the rising edge of SCLK Data should be transitioned on the falling edge of SCLK The maximum frequency of SCLK is 1MHz SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The first byte contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation. The following 7 bits contain the Address. In cases of multiple-byte Read/Writes, data is two or more bytes: SPI Address format MSB R/W A6 A5 A4 SPI Data format MSB D7 D6 D5

D4

A3

D3

A2

D2

A1

LSB A0

D1

LSB D0

6. s Single or Burst Read/Writes. Figure 11: Typical SPI Master/Slave Configuration

SCLK SDI SDO

SPI Master /CS1

SPI Slave 1

/CS

/CS2

SCLK SDI SDO /CS

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SPI Slave 2



7 7.1

Serial Interface Considerations MPU-6052C ed Interfaces 2

The MPU-6052C s I C communications on both its primary (microprocessor) serial interface and its auxiliary interface.. The MPU-6052C’s I/O logic levels are set to be VDDIO. The figure below depicts a sample circuit of MPU-6052C with a third party magnetometer attached to the 2 auxiliary I C bus. It shows the relevant logic levels and voltage connections. Note: Actual configuration will depend on the auxiliary sensors used. VDDIO

(0V - VDDIO)

SYSTEM BUS

System Processor IO

VDD VDDIO

VDD

INT SDA

(0V - VDDIO)

VDDIO

SCL

(0V - VDDIO)

VDDIO

(0V - VDDIO) (0V - VDDIO)

FSYNC

MPU-6052C

VDD_IO

VDDIO AUX_DA (0V, VDDIO)

AD0

AUX_CL

(0V - VDDIO) (0V - VDDIO)

VDD_IO

3rd Party Magnetometer

CS

SDA

INT 1

SCL

INT 2 SA0

(0V, VDDIO) (0V - VDDIO) (0V - VDDIO) (0V, VDDIO)

Figure 12: I/O Levels and Connections

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8


Assembly

This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.

8.1 Orientation of Axes The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1 identifier (•) in the figure. +Z

+Y

+Z MP U60

+Y 52

C

+X

+X

Figure 13: Orientation of Axes of Sensitivity and Polarity of Rotation

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8.2

Package Dimensions

24 Lead QFN (4x4x0.9) mm NiPdAu Lead-frame finish

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9


Part Number Package Marking

The part number package marking for MPU-6052C devices is summarized below: Part Number

Part Number Package Marking

MPU-6052C

MPU6052C

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10 Reliability 10.1 Qualification Test Policy InvenSense’s products complete a Qualification Test Plan before being released to production. The Qualification Test Plan for the MPU-6052C followed the JEDEC JESD 47I Standard, “Stress-Test-Driven Qualification of Integrated Circuits,” with the individual tests described below. 10.2 Qualification Test Plan Accelerated Life Tests TEST

Method/Condition

Lot Sample Quantity / Lot

Acc / Reject Criteria

(HTOL/LFR) High Temperature Operating Life

JEDEC JESD22-A108D Dynamic, 3.63V biased, Tj>125°C [read-points: 168, 500, 1000 hours]

3

77

(0/1)

(HAST) (1) Highly Accelerated Stress Test

JEDEC JESD22-A118A Condition A, 130°C, 85%RH, 33.3 psia., unbiased [read-point: 96 hours]

3

77

(0/1)

(HTS) High Temperature Storage Life

JEDEC JESD22-A103D Condition A, 125°C Non-Bias Bake [read-points: 168, 500, 1000 hours]

3

77

(0/1)

Device Component Level Tests TEST

Method/Condition

Lot Sample Quantity / Lot

(ESD-HBM) ESD-Human Body Model

JEDEC JS-001-2012 (2KV)

1

3

(0/1)

(ESD-MM) ESD-Machine Model

JEDEC JESD22-A115C (250V)

1

3

(0/1)

(ESD-CDM) ESD-Charged Device Model

JEDEC JESD22-C101E (500V)

1

3

(0/1)

(LU) Latch Up

JEDEC JESD-78D Class II (2), 125°C; ±100mA 1.5X Vdd Over-voltage

1

6

(0/1)

(MS) Mechanical Shock

JEDEC JESD22-B104C, Mil-Std-883, 2002.5 Cond. E, 10,000g’s, 0.2ms, ±X, Y, Z – 6 directions, 5 times/direction

3

5

(0/1)

(VIB) Vibration

JEDEC JESD22-B103B Variable Frequency (random), Cond. B, 5-500Hz, X, Y, Z – 4 times/direction

1

5

(0/1)

(TC) (1) Temperature Cycling

JEDEC JESD22-A104D Condition G [-40°C to +125°C], Soak Mode 2 [5’] [read-Point: 1000 cycles]

3

77

(0/1)

Method

(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

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Acc / Reject Criteria



11 Reference Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:  Manufacturing Recommendations o Assembly Guidelines and Recommendations o PCB Design Guidelines and Recommendations o MEMS Handling Instructions o ESD Considerations o Reflow Specification o Storage Specifications o Package Marking Specification o Tape & Reel Specification o Reel & Pizza Box Label o Packaging o Representative Shipping Carton Label  Compliance o Environmental Compliance o DRC Compliance o Compliance Declaration Disclaimer

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This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are ed trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.

©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.

©2014 InvenSense, Inc. All rights reserved.

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